2.1. System top-level partitioning

The IoT Subsystem consists of partitions of smaller sub-blocks. The IoT Subsystem is extended by additional components in the SoC integration layer.


The provided example system is for information only and ARM expects that the system designers will customize it for their application requirements.

The figure below shows the top-level block diagram with the AHB-Lite and APB bus interconnections.

Figure 2.1. Bus interconnections

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