B.1.1. FPGA current requirements

See the Xilinx web sitehttp://www.xilinx.com, for software to help you calculate the current requirements for your particular application.

Table B.1 shows the maximum current available to supply each power domain of the FPGAs on the daughterboard and the IO pins on any expansion board supplied through the upper headers, HDRXU and HDRYU.

Table B.1. Available FPGA current

Power domain




VCCINT16ASupplies the FPGA cores.
VCCAUX5AFPGA auxiliary supply voltage.
VIO4.5ACurrent supplied by the motherboard to the daughterboard IO pins that communicate with the motherboard FPGA IO pins.
MGTAVCC1.8ASupply for the internal analog circuits of the GTX transceiver on FPGA 1, 550T.
MGTAVTT1.8AAnalog supply for the transmitter and receiver termination circuits of the GTX transceiver on FPGA 1, 550T.
VIO_UP9ACurrent shared between the IO pins that communicate between FPGA 1 and FPGA 2 and any expansion board supplied through the upper header connectors, HDRXU and HDRYU.


  • It is possible for some FPGA designs to exceed the current and temperature rating of the board. For this reason, you must estimate the power requirements of such designs, using tools such as Xilinx XPE, before implementation.

  • The heatsinks supplied on each FPGA have a thermal resistance of 2°C per Watt. The recommended maximum FPGA temperature is 80°C.

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